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SSM3K107TU
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type
SSM3K107TU
High-Speed Switching Applications
* * 4 V drive Low ON-resistance: Unit: mm Ron = 410 m (max) (@VGS = 4V) Ron = 200 m (max) (@VGS = 10V)
0.650.05 2.10.1 1.70.1 +0.1 0.3 -0.05 3 0.1660.05
Absolute Maximum Ratings (Ta = 25C)
Characteristic Drain-source voltage Gate-source voltage Drain current Drain power dissipation Channel temperature Storage temperature range DC Pulse Symbol VDS VGSS ID IDP PD (Note 1) PD (Note 2) Tch Tstg Rating 20 20 1.5 3.0 800 500 150 -55~150 Unit V V A mW C C
2.00.1
1 2
0.70.05
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Mounted on a ceramic board. 2 (25.4 mm x 25.4 mm x 0.8 t, Cu Pad: 645 mm ) Note 2: Mounted on an FR4 board. 2 (25.4 mm x 25.4 mm x 1.6 t, Cu Pad: 645 mm )
Note:
1: Gate 2: Source 3: Drain UFM JEDEC JEITA TOSHIBA 2-2U1A
Weight: 6.6 mg (typ.)
Electrical Characteristics (Ta = 25C)
Characteristic Drain-source breakdown voltage Drain cutoff current Gate leakage current Gate threshold voltage Forward transfer admittance Drain-source ON-resistance Input capacitance Output capacitance Reverse transfer capacitance Switching time Turn-on time Turn-off time Symbol V (BR) DSS IDSS IGSS Vth Yfs RDS (ON) Ciss Coss Crss ton toff VDSF Test Condition ID = 1 mA, VGS = 0 VDS = 20 V, VGS = 0 VGS = 20 V, VDS = 0 VDS = 5 V, ID = 0.1 mA VDS = 5 V, ID = 0.6 A ID = 0.6 A, VGS = 10 V ID = 0.6 A, VGS = 4 V VDS = 10 V, VGS = 0, f = 1 MHz VDS = 10 V, VGS = 0, f = 1 MHz VDS = 10 V, VGS = 0, f = 1 MHz VDD = 10 V, ID = 0.6 A, VGS = 0 to 4 V, RG = 10 ID = - 1.5 A, VGS = 0 V (Note3) (Note3) (Note3) (Note3) Min 20 1.1 0.68 Typ. 1.36 135 250 60 47 17 19 10 - 0.9 Max 1 1 2.3 200 410 - 1.2 Unit V A A V S m pF pF pF ns V
Drain-source forward voltage
Note3: Pulse test
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SSM3K107TU
Switching Time Test Circuit
(a) Test Circuit (b) VIN
OUT IN 0V RG 10 s VDD = 10 V RG = 10 D.U. < 1% = VIN: tr, tf < 5 ns Common Source Ta = 25C 10% 4V 90%
4V 0
VDD
(c) VOUT
VDD
10% 90% tr ton tf toff
VDS (ON)
Marking
3
Equivalent Circuit (top view)
3
KK7
1 2 1 2
Notice on Usage
Vth can be expressed as the voltage between gate and source when the low operating current value is ID = 0.1 mA for this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower voltage than Vth. (The relationship can be established as follows: VGS (off) < Vth < VGS (on).) Take this into consideration when using the device.
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials.
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SSM3K107TU
ID - VDS
3.0 2.5 10 V 6V 10 Common Source VDS = 5 V
ID - VGS
(A)
(A)
4V 3.7V
1
ID
2.0
ID Drain current
0.1 Ta = 100 C 0.01 25 C
Drain current
1.5
VGS = 3.3V
1.0
0.5
Common Source Ta = 25C 0 0.2 0.4 0.6 0.8 1
0.001
-25 C
0
0.0001 0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Drain-source voltage
VDS
(V)
Gate-source voltage
VGS
(V)
RDS (ON) - VGS
600 ID = 0.6 A 600
RDS (ON) - ID
Common Source
Drain-source ON-resistance RDS (ON) (m)
Drain-source ON-resistance RDS (ON) (m)
500
Common Source
500
Ta = 25C
400
400
300 Ta =100 C 200 25 C
300
VGS = 4.0
200 10V 100 0
100 0
-25 C
0
2
4
6
8
10
0
1
2
3
4
5
Gate-source voltage
VGS
(V)
Drain current
ID
(A)
RDS (ON) - Ta
500 2.0
Vth - Ta Vth (V) Gate threshold voltage
Common Source
Drain-source on-resistance RDS (ON) (m)
400
1.5
300
ID = 0.6A / VGS = 4.0 V
1.0
200
0.6 A / 10V
0.5
100
Common source VDS = 5 V ID = 0.1 mA 0 50 100 150
0 -50
0 0 50 100 150 -50
Ambient temperature
Ta
(C)
Ambient temperature
Ta
(C)
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SSM3K107TU
|Yfs| - ID (S)
10 Common Source 10 Common Source
IDR - VDS
Yfs
(A)
VDS = 5 V 3 Ta = 25C
1
VGS = 0 V Ta = 25C
D IDR S
Forward transfer admittance
IDR
G
0.1
1
Drain reverse current
0.1 1 10
0.01
0.3
0.001
0.1 0.01
0.0001 0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
Drain current
ID
(A)
Drain-source voltage
VDS
(V)
C - VDS
1000 Common Source 500 Ta = 25C f = 1 MHz VGS = 0 V 600
t - ID
(pF)
(ns)
toff 100 tf
300
C
100 50 30 Ciss Coss
Switching time
Capacitance
t
10
ton tr Common Source VDD = 10 V VGS = 0 to 4 V Ta = 25C RG = 10 0.1 1 10
10 0.1
Crss 1 10 100
1 0.01
Drain-source voltage
VDS
(V)
Drain current
ID
(A)
Dynamic Input Characteristic
10 600
t - ID c b a
VGS
8
Gate-Source voltage
6
VDD = 16 V
4
Transient thermal impedance Rth (C/W)
(V)
100
10
2
Common Source ID = 1.2 A Ta = 25 C 0 1 2 3 4 1 0.001
a: Mounted on a ceramic board b: Mounted on an FR4 board
(25.4 x 25.4 x 0.8 mm
Cu Pad : 645 mm )
2
2
0
(25.4 x 25.4 x 1.6 mm Cu Pad : 645 mm ) c: Mounted on an FR4 board 2 (25.4 x 25.4 x 1.6 mm Cu Pad : 0.36 mm x 3)
Total gate charge
Qg
(nC)
0.01
0.1
1
10
100
600
Pulse Width
tw (s)
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2007-11-01
SSM3K107TU
PD - Ta
1000 a: Mounted on an FR4 board
(mW)
b: Mounted on a ceramic board
(25.4 x 25.4 x 0.8 mm
(25.4 x 25.4 x 1.6 mm
Cu Pad : 645 mm ) Cu Pad : 645 mm )
2
2
800
Drain Power Dissipation
PD
b
600
a
400
200
0 -40
-20
0
20
40
60
80
100 120 140 160
Ambient temperature
Ta
(C)
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2007-11-01
SSM3K107TU
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN GENERAL
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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2007-11-01

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